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? 2006 microchip technology inc. ds21390d-page 1 tc1411/tc1411n features latch-up protected: will withstand 500 ma reverse current input will withstand negative inputs up to 5v esd protected: 4 kv high peak output current: 1a wide input supply voltage operating range: - 4.5v to 16v high capacitive load drive capability: - 1000 pf in 25 nsec short delay time: 30 nsec typ. matched delay times low supply current - with logic 1 input: 500 a - with logic 0 input: 100 a low output impedance: 8 available in space-saving 8-pin msop package pinout same as tc1410/tc1412/tc1413 applications switch mode power supplies pulse transformer drive line drivers relay driver description the tc1411/tc1411n are 1a cmos buffers/drivers. they will not latch-up under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spiking of either polarity occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of current of either polarity being forced back into their output. all terminals are fully protected against up to 4 kv of electrostatic discharge. as mosfet drivers, the tc1411/tc1411n can easily charge a 1000 pf gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the on and the off states to ensure the mosfets intended state will not be affected, even by large transients. the leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. package types v dd in nc gnd v dd outgnd out 12 3 4 5 6 7 8 8-pin msop/pdip/soic v dd out gnd v dd in nc gnd out tc1411 nc = no internal connection 2 6,7 inverting 2 6,7 non-inverting 1 2 345 6 7 8 tc1411n note: duplicate pins must be connected together for proper operation. 1a high-speed mosfet drivers downloaded from: http:///
tc1411/tc1411n ds21390d-page 2 ? 2006 microchip technology inc. functional block diagram effective input c = 10 pf tc1411n output input gnd v dd 300 mv 4.7v inverting non-inverting outputs outputs tc1411 downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 3 tc1411/tc1411n 1.0 electrical characteristics absolute maximum ratings ? supply voltage ..................................................... +20v input voltage ...................... v dd + 0.3v to gnd C 5.0v power dissipation (t a 70c) msop .......................................................... 340 mw pdip ............................................................ 730 mw soic............................................................ 470 mw storage temperature range .............. -65c to +150c maximum junction temperature ...................... +150c ? stresses above those li sted under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and f unctional operation of the device at these or any other conditions above those indicated in the operation sections of the spec ifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, over operat ing temperature range with 4.5v v dd 16v. typical values are measured at t a = +25c, v dd = 16v. parameters sym min typ max units conditions input logic 1 , high input voltage v ih 2.0 v logic 0 , low input voltage v il 0 . 8v input current i in -1.0 1.0 a 0v v in v dd, t a = +25c -10 10 -40c t a +85c output high output voltage v oh v dd C 0.025 v dc test low output voltage v ol 0.025 v dc test output resistance r o 81 1 v dd = 16v, i o = 10 ma, t a = +25c 1 01 4 0 c t a +70c 10 14 -40c t a +85c peak output current i pk 1 . 0a v dd = 16v latch-up protection withstand reverse current i rev 0.5 a duty cycle 2%, t 300 s, v dd = 16v switching time (note 1) rise time t r 2 53 5n s t a = +25c 2 74 0 0 c t a +70c 29 40 -40c t a +85c, figure 4-1 fall time t f 2 53 5n s t a = +25c 2 74 0 0 c t a +70c 29 40 -40c t a +85c, figure 4-1 delay time t d1 3 04 0n s t a = +25c, 3 34 5 0 c t a +70c 35 45 -40c t a +85c, figure 4-1 delay time t d2 3 04 0n s t a = +25c 3 34 5 0 c t a +70c 35 45 -40c t a +85c, figure 4-1 power supply power supply current i s 0 . 51 . 0m a v in = 3v, v dd = 16v 0.1 0.15 v in = 0v note 1: switching times ensured by design. downloaded from: http:///
tc1411/tc1411n ds21390d-page 4 ? 2006 microchip technology inc. temperature characteristics electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 16v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0+ 7 0o c specified temperature range (e) t a -40 +85 oc specified temperature range (v) t a -40 +125 oc maximum junction temperature t j + 1 5 0o c storage temperature range t a -65 +150 oc package thermal resistances thermal resistance, 8l-msop ja 2 0 6o c / w thermal resistance, 8l-pdip ja 1 2 5o c / w thermal resistance, 8l-soic ja 1 5 5o c / w downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 5 tc1411/tc1411n 2.0 typical performance curves note: unless otherwise indicated, over operating temperature range with 4.5v v dd 16v. figure 2-1: quiescent supply current vs. supply voltage. figure 2-2: input threshold vs. supply voltage. figure 2-3: high-state output resistance vs. supply voltage. figure 2-4: quiescent supply current vs. temperature. figure 2-5: input threshold vs. temperature. figure 2-6: low-state output resistance vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. the performance characteristics listed herein are not tested or guaranteed. in so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 0 100 200 300 400 500 16 14 12 10 8 6 4 v in = 3v v in = 0v t a = +25 c i supply ( a) v dd (v) 1.1 1.2 1.3 1.4 1.5 1.6 16 14 12 10 8 6 4 t a = +25 c v dd (v) v threshold (v) v ih v il r ds-on (ohms) v dd (v) 0 5 10 15 20 25 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c -40 -20 0 20 40 60 80 0 100 200 300 400 500 i supply ( a) v in = 3v v in = 0v v supply = 16v temperature ( c) -40 -20 0 20 40 60 80 1.1 1.2 1.3 1.4 1.5 1.6 v supply = 16v temperature ( c) v threshold (v) v ih v il r ds-on (ohms) v dd (v) 0 5 10 15 20 25 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c downloaded from: http:///
tc1411/tc1411n ds21390d-page 6 ? 2006 microchip technology inc. note: unless otherwise indicated, over op erating temperature range with 4.5v v dd 16v. figure 2-7: rise time vs. supply voltage. figure 2-8: propagation delay vs. supply voltage. figure 2-9: rise and fall times vs. capacitive load. figure 2-10: fall time vs. supply voltage. figure 2-11: propagation delay vs. supply voltage. figure 2-12: propagation delays vs. capacitive load. v dd (v) t rise (nsec) 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c c load = 1000 pf 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c v dd (v) c load = 1000 pf t d1 (nsec) 0 500 1000 1500 2000 2500 3000 3500 0 20 40 60 80 100 t fall t rise t rise , t fall (nsec) c load (pf) t a = +25 c v dd = 16v t fall (nsec) 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = +85 c t a = -40 c t a = +25 c c load = 1000 pf v dd (v) v dd (v) t d2 (nsec) 0 20 40 60 80 100 16 14 12 10 8 6 4 c load = 1000 pf t a = -40 c t a = +25 c t a = +85 c c load (pf) propagation delays (nsec) t d1 0 500 1000 1500 2000 2500 3000 3500 26 28 30 32 34 36 t d2 t a = +25 c v dd = 16v downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 7 tc1411/tc1411n 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 16v with respect to the ground pin. the v dd input should be bypassed to ground with a local ceramic capacitor. the value of the capacitor should be chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. 3.2 control input (input) the mosfet driver input is a high-impedance, ttl/cmos-compatible input . the input has 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 cmos push-pull output (output) the mosfet driver output is a low impedance, cmos push-pull style output, capable of driving a capacitive load with 1a peak currents. 3.4 ground (gnd) the ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. the ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 no connect (nc) no internal connection. pin no. symbol description 1v dd supply input, 4.5v to 16v 2 input control input 3 nc no connection 4 gnd ground 5 gnd ground 6 output cmos push-pull output, common to pin 7 7 output cmos push-pull output, common to pin 6 8v dd supply input, 4.5v to 16v downloaded from: http:///
tc1411/tc1411n ds21390d-page 8 ? 2006 microchip technology inc. 4.0 application information figure 4-1: switching time test circuit. c l = 1000 pf 0.1 f 4.7 f inverting driver non-inverting driver input v dd = 16v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 nsec output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd0v 0v 0v 90% 4, 5 2 6, 7 1, 8 tc1411 tc1411n tc1411n tc1411 downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 9 tc1411/tc1411n 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: tc1411 cpa^^256 0635 8-lead soic (150 mil) example: xxxxxxxxxxxxyyww nnn tc1411c oa^^0635 256 8-lead msop example: xxxxxxx ywwnnn 1411ne635256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e downloaded from: http:///
tc1411/tc1411n ds21390d-page 10 ? 2006 microchip technology inc. 8-lead plastic micro small outline package (ua) (msop) d a a1 l c a2 e1 e p b n1 2 f dimensions d and e1 do not include mold flash or protrusions. mo ld flash or protrusions shall not exceed .010" (0.254mm) per s ide. .037 ref f footprint (reference) notes: revised 07-21-05 * controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 bsc .033 min p n units .026 bsc nom 8 inches 0.95 ref -- .009 .016 0.08 0.22 0 0.230.40 8 millimeters * 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.100.80 0.15 0.95 max 8 - -- 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - -- bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. see asme y14.5m see asme y14.5m drawing no. c04-111 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 11 tc1411/tc1411n 8-lead plastic dual in-line (pa) C 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches * millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51 01 5 51 01 5 mold draft angle bottom 51 01 5 51 01 5 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mo ld flash or protrusions shall not exceed .010 (0.254mm) per si de. jedec equivalent: ms-001 drawing no. c04-018 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
tc1411/tc1411n ds21390d-page 12 ? 2006 microchip technology inc. 8-lead plastic small outline (oa) C narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches * units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010 (0.254mm) per si de. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.micro chip.com/packaging downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 13 tc1411/tc1411n appendix a: revision history revision d (september 2006) added -40c to +125c temperature range to temperature characteristics table and product information system page. added disclaimer to package outline drawings. revision c (march 2003) added 8-lead msop package. revision b (may 2002) converted telcom data sheet for embedded control handbook revision a (march 2001) original release of this document. downloaded from: http:///
tc1411/tc1411n ds21390d-page 14 ? 2006 microchip technology inc. notes: downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 15 tc1411/tc1411n product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: tc1411: 1 a single mosfet driver, inverting tc1411n: 1 a single mosfet driver, non-inverting temperature range: c = 0c to +70c e = -40c to +85c v = -40c to +125c package: oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) ua = plastic micro small outline (msop), 8-lead * ua713 = plastic micro small outline (msop), 8-lead * (tape and reel) pa = plastic dip (300 mil body), 8-lead * msop package is only available in e-temp. part no. x /xx package temperature range device examples: a) tc1411coa: 1a single mosfet driver, 8ld soic pkg, 0c to +70c. b) tc1411cpa: 1a single mosfet driver, 8ld pdip package, 0c to +70c. c) tc1411eua713: tape and reel, 1a single mosfet driver, 8ld msop package, -40c to +85c. d) tc1411voa713: tape and reel, 1a single mosfet driver, 8ld soic pkg, -40c to +125c. a) tc1411ncpa: 1a single mosfet driver, 8ld pdip package, 0c to +70c. b) tc1411nepa: 1a single mosfet driver, 8ld pdip package, -40c to +85c. c) tc1411neua: 1a single mosfet driver, 8ld msop package, -40c to +85c. d) tc1411nvpa: 1a single mosfet driver, 8ld pdip package, -40c to +125c downloaded from: http:///
tc1411/tc1411n ds21390d-page 16 ? 2006 microchip technology inc. notes: downloaded from: http:///
? 2006 microchip technology inc. ds21390d-page 17 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microc hip technology incorporated in the u.s.a. and other countries. amplab, filterlab, migratable memory, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered tradema rks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, application maestro, codeguard, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, linear active thermistor, mindi, miwi, mpasm , mplib, mplink, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, real ice, rflab, rfpicdem, select mode, smart serial, smarttel, total endurance, uni/o, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2006, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona, gresham, oregon and mountain view, california. the companys quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development syst ems is iso 9001:2000 certified. downloaded from: http:///
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